发明名称 MANUFACTURE OF PIEZOELECTRIC DEVICE
摘要 PROBLEM TO BE SOLVED: To highly precisely thin a piezoelectric body and to facilitate handling by jointing a piezoelectric body member to a substrate member and working a flat part facing the junction face of the jointed piezoelectric member. SOLUTION: An adhesive is applied on the surface of a substrate member 3, the substrate member 3 is rotated at high speed, and a uniform adhesion layer is formed. A piezoelectric body 2 is overlapped on the adhesion layer so as to joint them. A face opposite to a junction face, to which the piezoelectric body 2 of the substrate member 3 is jointed, is held to a vacuum chuck plate and the piezoelectric body 2 is thinned to prescribed thickness by a single-face polishing method. A working surface 10 side of the piezoelectric body 2 is held, and plural opening parts 11 are formed in the substrate member 3. Exciting electrodes are formed in the center position of the opening part 11 on the working surface 10 side of the thinned piezoelectric body 2 and the center position of the opening part 11 on the surface of the piezoelectric body 2 exposed to the opening part 11. A member is divided after the exciting electrode is formed, and a separate piezoelectric oscillator is obtained.
申请公布号 JP2000151321(A) 申请公布日期 2000.05.30
申请号 JP19980327142 申请日期 1998.11.17
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIRATANI TATSUO;IZUNO CHIZUO;SUGIMOTO MASAHITO
分类号 H01L41/22;H01L41/313;H03H3/02;H03H9/02;H03H9/17 主分类号 H01L41/22
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