| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the 3dB band width and high-frequency return loss, for an ultra-fast (2.5 Gbps, 10 Gbps) optical communication module. SOLUTION: This device is formed in a fixed size so as to have an inductance component 20 and a capacitance component 19, respectively, with a cross- shaped microstrip line, an EML24 and a thin-film resistor or chip resistor 27 are connected with a bonding wire 22, and the inductance generated here is appropriately adjusted using the length of bonding wire. Thus, the 3dB band width represents 18 GHz with a 10 Gbps module, while a high-frequency return loss is improved from a current -4dB to -14dB at 10 GHz.</p> |
