发明名称 PACKAGE FOR HOUSING OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To enable to operate an optical semiconductor device normally and in a stable condition at all times by making the optical semiconductor device correctly inputting and outputting electrical signals. SOLUTION: A package for housing an optical semiconductor device comprises a substrate 1 having a placing part 1a on the top of which the optical semiconductor device 4 is placed through an electronic cooling device 5, a frame 2 having a through hole 2a and a notch 2b on its sides which is mounted on the substrate 1 in such a way that it surrounds the optical semiconductor device placing part 1a, a cylindrical fixing element 9 which is mounted in the through hole 2a or on the frame around the through hole 2a and to which an optical fiber element 11 is joined, a ceramic terminal 6 which is mounted on the notch 2b and on which a metallized wiring layer 8 is formed for electrically connecting electrodes of the optical semiconductor device 4 to an insulator 7, and a lid 3 which is mounted on the top of the frame 2 for hermetically sealing the optical semiconductor device 4. In this case, the insulator 7 of the ceramic terminal 6 is made of aluminum nitride sintered compact.
申请公布号 JP2000150693(A) 申请公布日期 2000.05.30
申请号 JP19980327220 申请日期 1998.11.17
申请人 KYOCERA CORP 发明人 KOBAYASHI MINORU
分类号 H01L23/12;G02B6/42;H01L23/02;H01L23/08;H01L23/38;H01S5/00;H01S5/022;(IPC1-7):H01L23/02 主分类号 H01L23/12
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