发明名称 Channeled heat sink
摘要 The heat sink includes a mounting block having a channel for clamping a device being coupled to the heat sink. The channel serves as a clamp to substantially eliminate relative rotation between the heat sink and the device when the device is being fastened to the heat sink. The heat sink further includes a first wall and a second wall wherein the first and second walls and the mounting block provide a substantially U-shaped body for the heat sink. In one embodiment, the heat sink includes a threaded nut aligned with a hole in the channel to ease alignment issues when the device is being fastened to the heat sink. In one embodiment, the heat sink includes convection fins extending from a U-shaped base and a U-shaped top of the heat sink. In one embodiment, the heat sink includes mounting pins inserted into the base of the heat sink. In one embodiment, the heat sink includes anti-tipping pins inserted into the base of the heat sink. The mounting pins and the anti-tipping pins have a knurled portion in one embodiment. Additional fillet between convection fins provides the anti-tipping pins with a gripping surface when they are inserted into the base. Additional fillet formed at the junction of the first and second wall and the mounting block provides the mounting pins with a gripping surface when they are inserted into the base. The U-shaped body is capable of being manufactured through extrusion.
申请公布号 US6068051(A) 申请公布日期 2000.05.30
申请号 US19980046371 申请日期 1998.03.23
申请人 INTEL CORPORATION 发明人 WENDT, RANDALL DEAN
分类号 H01L23/367;(IPC1-7):H05K7/20 主分类号 H01L23/367
代理机构 代理人
主权项
地址