| 摘要 |
PROBLEM TO BE SOLVED: To prevent damage to a resin-sealed body when lead terminals of a resin-sealed semiconductor device are solder-coated by the solder-dipping method. SOLUTION: A solder bath 4 provided with molten solder 5 is prepared. Only the end portions 3a of lead terminals 3 of a resin-sealed semiconductor device having a resin-sealed body 2 and lead terminals 3 led out from the resin- sealed body 2 are once dipped in the molten solder 5 to preheat the lead terminals 3 for a certain time. Then, almost the entire lead terminals 3 except for the portions near the resin-sealed body 2 are dipped in the molten solder 5 for solder coating. If only the end portions 3a of the lead terminals are once dipped in the molten solder 5 to preheat the lead terminals 3 for a certain time, the heat of the lead-out portions 3b is transferred stepwise to the resin- sealed body 2 via the lead terminals 3. Therefore, resin defects near the lead-out portions 3b of the lead terminals 3 can be prevented.
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