| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for a semiconductor device which can correspond to high frequency. SOLUTION: In a lead frame 10 for a semiconductor device wherein each tip part 12a of a plurality of inner leads 12 aligns in one line at a specified pitch and a connection end part 12b with a dam bar 108 of the inner lead 12 aligns in one line parallel to the tip part 12a at a specified pitch which is wider than that of the tip part 12a, at least the inner lead 12 for signal is formed non-linear from the tip part 12a to the connection end part 12b. Furthermore, a distance from the tip part 12a to the connection end part 12b is formed the same practically. |
