| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacture of a semiconductor device which removes a resist-unapplied section from the surface of a semiconductor substrate, and also is applicable to the fine processing of a pattern, too. SOLUTION: This is the manufacture of a semiconductor substrate which forms a resist-applied film on the top surface of a semiconductor substrate 3 by placing a semiconductor substrate 3 on a rotary table 2, and arranging a mobile nozzle 14 above this semiconductor substrate 3, and dropping resist from this nozzle 14. At this time, the resist-applied film is made by dropping resist while shifting the nozzle 14 in the center direction from the periphery of the rotating semiconductor substrate 3. |
