HEAT CURABLE TOUGHENED EPOXY RESIN COMPOSITIONS

摘要

This invention is a two-part induction-curable epoxy adhesive comprising a first part of a polyfunctional epoxy such as a sorbitol epoxy, and a diepoxy compound such as a diepoxy bisphenol-A wherein a portion of the diepoxy compound may preferably comprise a glycol-based epoxy having an epoxy equivalent weight of at least about 250. The second part of the adhesive is a curing agent which preferably may be a mixture of nitrogen-based compounds, and a toughening agent. The invention also comprises a method of adjoining two substrates by applying the adhesive composition of the invention and curing as well as the article resulting from this method.