| 摘要 |
PROBLEM TO BE SOLVED: To obtain a multiple piece board in which a plated metallic layer having a predetermined thickness can be formed on all wiring conductors by electroplating by making small variations in the thickness of the plated metallic layer. SOLUTION: In the multiple piece pattern board, a rectangular plating common conductor frame 6 is provided at an outer periphery of a matrix substrate 1, a multiplicity of wiring piece board zones 2 each having wiring conductors 5a and 5b are disposed inside the frame 6, the wiring conductors 5a and 5b are each arranged in a plurality of rows, the conductors 5a or 5b in each row are electrically connected each other, connecting conductors 7 extended from each row of the wiring conductors are connected to opposing two sides of the frame 6, the remaining two sides of the frame 6 are provided with terminal parts 6a connected to a plating power supply. Since charge concentration at ones of the wiring conductors in each row located at its both ends can be avoided, a plated metallic layer having a predetermined thickness can be formed on all the wiring conductors 5a and 5b with less variations in its thickness.
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