| 摘要 |
<p>PROBLEM TO BE SOLVED: To increase packaging density without reducing the sizes of electronic components by burying electronic components in the main body of a synthetic resin substrate. SOLUTION: Chip components 1 are put and positioned between inner faces of a pair of synthetic resin sheets 2. Next, a metal sheet 4 which is formed on one face with conical or pyramidal-bumps 3 are laid on an outer face of each of the synthetic resin sheets 2, with the face formed with the bumps facing the sheet 2. Then, this multilayer body is pressed in the direction shown by an arrow X under heat. By this pressing, the synthetic resin sheets 2 melt and enter spaces between the chip components 1, integrating the synthetic resin and the chip components 1. During this process, the bumps 3 are buried in the main body 5 of a substrate to be electrically connected to electrodes 1a. As a result, the synthetic resin sheets 2 and the metal sheets 4 are integrated into the main body 5 of a substrate. Thereafter, the metal sheets 4 are patterned into wiring patterns 6.</p> |
