| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an IC card with which various uses are expected and which has a high commercial value at a low cost by pressing and adhering a middle sheet and surface and rear face sheets under the decompression by using a reaction type polyurethane hot melt resin. SOLUTION: A middle sheet 3, a surface sheet 1 and a rear face sheet 2 are pressed and adhered under the decompression by using a reaction type polyurethane hot melt resin 6. As for the material for the sheets 1 and 2, various plastic or the like, paper and synthetic paper having printability and appropriate strength, metal and ceramic are listed. Also, as for the material of the sheet 3, various non-woven fabrics are listed other than various plastics or the like, paper, etc. Easy adhesion processing (the coating of, e.g. a primer resin (e.g. an urethane resin), corona discharge processing, plasma processing, etc.), can be applied to the rear face of the sheet 1, the surface of the sheet 2 and the surface and rear face of the sheet 3 in order to improve the adhesive property to the resin 6.</p> |
