SINGLE CHIP RADIO STRUCTURE AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To maintain the superior performance of frequency stability and low power consumption by including a metal wire or bonding wire which directly connects an element formed on a piezoelectric dielectric film and an integrated circuit formed on a silicone substrate. SOLUTION: A precise resonator using a piezoelectric dielectric 104 or one and above surface acoustic wave filter elements selecting a specified frequency is formed. The manual operation circuit elements of an inductor, a capacitor and a resistor, which are selectively added and integrated on a piezoelectric dielectric 104 film, and integrated circuit including a part or all of an oscillator 205 formed on a silicone substrate 101, a downward converter 212 and a demodulator 213 are formed. A metal wire 106 or a boding wire which directly connects the element formed on the piezoelectric dielectric 104 film and the integrated circuit formed on the silicone substrate 101 is constituted so that single chip radio structure is obtained.