发明名称 HIGH FREQUENCY SURFACE MOUNTING PACKAGE
摘要 <p>PROBLEM TO BE SOLVED: To suppress echo distortion, mismatch and radiation loss without relying upon an external circuit by providing a radio wave absorber arranged on a ceiling board covering the upper surface of an electrode plate. SOLUTION: The inventive high frequency surface mounting package is different from a conventional one in that a radio wave absorber 10 is applied to a part of the upper surface of a ceiling board 108. When the radio wave absorber 10 is arranged on the ceiling board 108, basic mode is not attenuated substantially but only a radiation mode is attenuated and the components being re-coupled with the basic mode is weakened. Consequently, periodic amplitude distortion attributed to the phase difference between the basic wave and a re-coupled wave is reduced thus suppressing generation of one-way echo distortion. According to the arrangement, three problems incident to mounting a high frequency surface mounting package onto an external circuit, i.e., echo distortion, mismatch and radiation loss, can be suppressed without relying upon an external circuit.</p>
申请公布号 JP2000150692(A) 申请公布日期 2000.05.30
申请号 JP19980321609 申请日期 1998.11.12
申请人 SHIMADA PHYS & CHEM IND CO LTD 发明人 AZUMA KAZUYUKI;UCHIYAMA FUMIHIKO;MAKI TOSHIO
分类号 H05K9/00;H01L23/02;H01L23/06;(IPC1-7):H01L23/02 主分类号 H05K9/00
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