| 摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor element to operate normally and stably for a long time by efficiently dissipating outwardly heat generated during the operation of the semiconductor element to always keep the semiconductor element at suitable temperature. SOLUTION: A package is formed by depositing a metal layer 7 having a three-layered structure of Cr-Fe alloy layer 7a, Cu layer 7b, and Fe-Ni alloy layer or Fe-Ni-Co alloy layer 7c on both upper and lower surfaces of a core body 2b which consists of an unidirectional composite material made by bonding carbon fiber wherein a heat dissipation plate 2 with a semiconductor element 5 disposed on is arranged in the depthwise direction using carbon by means of diffused junction. Each of the Cr-Fe alloy layer 7a, the Cu layer 7b, and the Fe-Ni alloy layer or the Fe-Ni-Co alloy layer 7c has the generally same depth as each other. |
