MANUFACTURE OF PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To realize a method of manufacturing a printed wiring board in which the adhesive characteristics between a copper conductor pattern and insulation resin is improved. SOLUTION: A copper conductor pattern 1 is roughened and a copper oxide film 3 is formed. A plated (metal) film 4 having metal particles which are distributed discretely is provided on the surface of the film 3. One example for forming the plated (metal) 4 film is a chemical plating treatment using a boron-based compound of nickel or cobalt. By this method, a reducing step of copper oxide can be omitted between an oxidation step of a copper surface and a metallic film forming step of the copper. Thereby, a printed wiring board excellent in acid-resistance and mechanical strength to high temperatures can be obtained.