发明名称 SURFACE-MOUNTABLE LED PACKAGE
摘要 PROBLEM TO BE SOLVED: To enable an LED package to optically highly efficiently operate by arranging slag composed of a heat-conductive material on the pedestal of a cavity and, at the same time, a lens in a lead frame opposite to the cavity. SOLUTION: An LED(light emitting diode) die 16 is directly or indirectly mounted on slag 10 which becomes a heat sink through a high heat-conductivity auxiliary pedestal 18. Then bonding wires are extended from the LED die 16 and auxiliary pedestal 18 until the wires reach the metallic leads of a lead frame 12 insert-molding the slag 10 in a state where the lead frame 12 is electrically and thermally isolated from the slag 10 and inserted into the lead frame 12. In addition, a lens 20 which makes optical activity is arranged in the lead frame 12 opposite to a cavity. Therefore, an LED can optically highly efficiently operate.
申请公布号 JP2000150967(A) 申请公布日期 2000.05.30
申请号 JP19990303910 申请日期 1999.10.26
申请人 AGILENT TECHNOL INC 发明人 CAREY JULIAN A;COLLINS III WILLIAM D;LOH BAN POH;SASSER GARY D
分类号 H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/60
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