发明名称 BACKSIDE INCIDENCE TYPE LIGHT RECEIVING DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a backside incidence type light receiving device of a structure, wherein with signal light incided obliquiely in the light absorbing layer of a light receiving element, the incident signal light is further made to reflect, the signal light can be introduced efficiently in the light absorbing layer in a narrower element region, the speedup of the element and an increase in the efficiency of the element can be realized, and the manufacturing method of the device. SOLUTION: The backside incidence type light receiving device is provided at least with a semiconductor light receiving element 3 and a singularity of a recessed slant reflective part 8 or a plurality of recessed slant reflective parts 8, formed independently in the side part or the side parts of the element 3 and is constituted into a structure, wherein signal light which is made incident from the backside of a substrate 1 is reflected by the slant reflective part 8 and is made incident in the element 3 from the direction oblique to the surface of the substrate. When the thickness of the substrate 1, the depth of the part 8 and an angle that the direction of incidence of the signal light which is reflected by the part 8 and is made incident in the element 2 makes with the surface of the substrate, are respectively defined as T, D andθ', a horizontal distance (z) between the end part, which is situated on the side of the part 8, of a light-absorbing layer 4 and the deepest part of the part 8 is set in the range of z<T/(10.tanθ').
申请公布号 JP2000150923(A) 申请公布日期 2000.05.30
申请号 JP19980321913 申请日期 1998.11.12
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 ITO HIROSHI;ISHIBASHI TADAO;FURUTA TOMOSHI;KODAMA SATOSHI
分类号 H01L31/02;H01L31/10;(IPC1-7):H01L31/02 主分类号 H01L31/02
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