发明名称 Pad with indentations surface mount
摘要 A surface mount pad and a component to be soldered onto the pad includes a main portion and two extension portions coupled to the main portion. The surface mount pad has an indentation which is defined by the extension portions. The portions extend from the main portion on opposing sides of the indentation. The extension portions are positioned to extend from underneath the component lead. The indentation extends underneath the component lead.
申请公布号 US6069323(A) 申请公布日期 2000.05.30
申请号 US19970786159 申请日期 1997.01.21
申请人 DELL USA, L.P. 发明人 SLUPEK, DARRELL J.;CLOWERS, BECKY J.
分类号 H05K1/11;H05K3/34;(IPC1-7):H05K1/16 主分类号 H05K1/11
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