发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To simultaneously create capacity and TFT on a semiconductor thin film, at the same time, to increase a capacity value, and to stabilize TFT characteristics. SOLUTION: A protection film 13 and a reflection prevention film 12 are formed on a semiconductor thin film 3, and each thickness is separately set, thus forming a Poly-Si film with superior uniformity and a Poly-Si film with large surface area on the semiconductor thin film under the protection film and under the reflection protection film, respectively, when a laser beam is applied. After that, a TFT and capacity are created on the Poly-Si film with superior uniformity and the Poly-Si film with large surface area, respectively.
申请公布号 JP2000150889(A) 申请公布日期 2000.05.30
申请号 JP19980318527 申请日期 1998.11.10
申请人 NEC CORP 发明人 HIRATA KAZUMI
分类号 H01L21/20;H01L21/336;H01L29/78;H01L29/786;(IPC1-7):H01L29/786 主分类号 H01L21/20
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