发明名称 |
Method for producing a polycrystalline silicon structure and polycrystalline silicon layer to be produced by the method |
摘要 |
A method for producing a polycrystalline silicon structure and a polycrystalline silicon layer to be produced by the method of first forming a primary silicon structure in an amorphous or polycrystalline form, and doping the structure with a dopant, in particular with oxygen, in a concentration exceeding the solubility limit. In a subsequent heat treatment, dopant precipitations are formed which control grain growth in a secondary structure being produced. Such a contact polycrystalline silicon structure can be used, in particular, as a connection of a monocrystalline silicon region.
|
申请公布号 |
US6068928(A) |
申请公布日期 |
2000.05.30 |
申请号 |
US19980030406 |
申请日期 |
1998.02.25 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
SCHREMS, MARTIN;WURSTER, KAI;MORHARD, KLAUS-DIETER;HOEPFNER, JOACHIM |
分类号 |
H01L21/768;H01L21/20;H01L21/265;H01L21/28;H01L21/285;(IPC1-7):B32B9/04;H01L21/36;H01L21/425 |
主分类号 |
H01L21/768 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|