发明名称 Method for producing a polycrystalline silicon structure and polycrystalline silicon layer to be produced by the method
摘要 A method for producing a polycrystalline silicon structure and a polycrystalline silicon layer to be produced by the method of first forming a primary silicon structure in an amorphous or polycrystalline form, and doping the structure with a dopant, in particular with oxygen, in a concentration exceeding the solubility limit. In a subsequent heat treatment, dopant precipitations are formed which control grain growth in a secondary structure being produced. Such a contact polycrystalline silicon structure can be used, in particular, as a connection of a monocrystalline silicon region.
申请公布号 US6068928(A) 申请公布日期 2000.05.30
申请号 US19980030406 申请日期 1998.02.25
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 SCHREMS, MARTIN;WURSTER, KAI;MORHARD, KLAUS-DIETER;HOEPFNER, JOACHIM
分类号 H01L21/768;H01L21/20;H01L21/265;H01L21/28;H01L21/285;(IPC1-7):B32B9/04;H01L21/36;H01L21/425 主分类号 H01L21/768
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