| 摘要 |
PROBLEM TO BE SOLVED: To efficiently form bump electrodes with high accuracy at a low cost. SOLUTION: In a method in which bump electrodes 6 are formed by bonding conductive balls 3 onto electrode pads 5 arranged on a semiconductor device 4 by supplying ultrasonic energy, a template 1 having recesses 2 in which the conductive balls 3 can be put without allowing the balls 3 in such a way that the balls 3 are not completely buried in the recesses 2 and which are formed correspondingly to the positions of the electrode pads 5 on the device 4 is first prepared. Then the balls 3 are put in the recesses 2 of the template 1 and the balls 3 and pads 5 are brought into contact with each other by facing the template 1 and semiconductor device 4 oppositely to each other. While the pads 5 are brought into contact with the balls 3, the balls 3 are bonded to the pads 5 at the abutting portions of the balls 3 with the pads 5 by supplying ultrasonic energy A through at least either one of the template 1 and device 4. |
