| 摘要 |
PROBLEM TO BE SOLVED: To significantly reduce manufacturing costs by generalizing a printed wiring board wherein flip chips are mounted without decreasing the connection reliability of bumps. SOLUTION: A carrier board 6 which is provided at a semiconductor device 1 of a CSP(chip size package) i.e., a surface-mounting package comprises a base board 7 such as epoxy resin and lead wires 8 such as copper which has anisotropy in the depthwise direction of the base board 7 and are formed at established intervals, and both ends of the lead wire 8 are exposed at the top and bottom surfaces. A semiconductor chip 2 is mounted on the carrier board 6 through a conductive paste 5 to bond metallic bumps 4 with the lead wires 8. A wiring pattern 11 which electrically connects an electrode portion 10 with an electrode pad 3 is formed on the back of the carrier board 6. The wiring pattern 11 is formed by irradiating the back of the carrier board 6 with laser light to melt the lead wires 8 formed on the base board 7. |
