SEMICONDUCTOR DEVICE MOUNTING DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent the occurrence of an irregular color in the periphery of the semiconductor device mounting section of a liquid crystal display panel on the screen of a liquid crystal display device, by relieving the warpage of a semiconductor device and the display panel which occurs when the lump electrodes of the semiconductor device are thermocompression-bonded to the wiring electrodes of the display panel. SOLUTION: The press-contacting surface 5a of a compression bonding tool 5 at the semiconductor device mounting position of a liquid crystal display panel 2 on which a semiconductor device 1 is mounted is formed in a flat or recessed surface so that the device 1 may be thermocompression-bonded to the panel 2 by means of the tool 5 and a compression bonding stage 4 having the same shape as that the device 1 has or an approximate shape. When the compression bonding surface 5a is formed in the above way, the occurrence of an irregular color in the peripheral of the semiconductor device mounting section of the panel 2 on the screen of a liquid crystal display device can be suppressed, because the warpage of the device 1 and panel 2 which occurs when the lump electrodes of the device 1 are thermocompression-bonded to the wiring electrodes of the panel 2 can be eliminated.