REFLOW TIN PLATING MATERIAL, AND TERMINAL, CONNECTOR, OR LEAD MEMBER USING REFLOW TIN PLATING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a reflow tin plating material suitable for terminal, connector, and leads and excellent in the anti-corrosiveness, solderability, and anti- corrosiveness. SOLUTION: On an Sn layer provided on a conductive base, a Bi layer and/or Ag layer is formed by a substitutional eduction method to a thickness of 0.01-0.5μm, followed by subjecting to a reflow processing, and the surface of the Sn layer and near the surface are turned into alloy with the Bi layer and/or Ag layer. The surface of the plating layer and near the surface are hardened owing to alloy formation to ensure excellent anti-abrasiveness and an enhanced anti- corrosiveness. Further these parts have a low melting point owing to alloy formation to assure an enhanced solderability. The Sn layer between the base and near the surface turned in alloy suppresses dispersion of the base material to the surface, which prevents drop of the solderability and anti-corrosiveness.