METHOD AND DEVICE FOR INSPECTING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method and device for inspecting semiconductor device by which the junctions between the electrodes of a semiconductor element and those of a circuit board can be inspected easily for defects. SOLUTION: After the circuit forming surface of a semiconductor element 2 is faced oppositely to the electrodes of a circuit board 1 and the electrodes 3 of the board 1 are bonded to the bumps of the element 2, the junctions between the electrodes 3 of the board 1 and bumps 4 of the element 2 are inspected for incomplete break from the improper vertical interval between the surface 6 of the board 1 and backside 7 of the element 2, by measuring the vertical interval at least at one spot at each corner of the element 2 having four corners, and comparing the height of the element 2 measured at least at two spots with each other.