| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of wiring by preventing stress of a barrier metal layer from concentrating on a second film thereby preventing deformation of the second film made of an organic insulating material and avoiding the occurrence of voids in a recess. SOLUTION: A wiring structure comprises a first film 12 formed on a substrate 11, a second film 13 of an organic insulating material covering the first film 12, a recess 14 (groove 14) made from the second film 13 to the first film 12, a barrier metal layer 15 formed on the inner wall of the groove 14, and a conductor 16 embedded in the groove 14 through the carrier metal layer 15. Bottom face 14b of the groove 14 and the lower side face 14s of the groove 14 continuous to the bottom face 14b are formed in the first film 12.
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