SUBSTRATE FOR SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a substrate with excellent heat dissipating property at low cost that has sufficient reliability even when it is bonded via metal with a semiconductor element or a ceramic substrate on which a semiconductor element is mounted. SOLUTION: This heat dissipating substrate 1 is obtained by inserting a composite material member 4 consisting of metal matrix of copper and/or copper alloy and carbon and/or graphite fibers into through holes 3 formed in a copper or copper alloy member 2 and intensely bonding them. A semiconductor element or a ceramic substrate provided with a semiconductor element is mounted on this substrate.