发明名称 SEMICONDUCTOR MEMORY AND FABRICATION THEREOF
摘要 PROBLEM TO BE SOLVED: To increase capacity between a floating gate electrode and a control gate electrode without lowering the reliability between them or increasing the memory size by making a trench in the floating gate electrode extending in the breadthwise direction thereof. SOLUTION: Since a trench 4a having recessed cross-section in the longitudinal direction of the gate is made on a floating gate electrode 4 in a semiconductor memory, surface area can be increased between the floating gate electrode 4 and a control gate electrode 6. Consequently, capacity between the floating gate electrode 4 and the control gate electrode 6 can be increased without making thin a second gate insulating film 5 or increasing overlap between the floating gate electrode 4 and a field oxide film 2 as required in prior art, and the reliability of gate insulating films 3, 5 can be ensured while reducing cell size.
申请公布号 JP2000150679(A) 申请公布日期 2000.05.30
申请号 JP19980320834 申请日期 1998.11.11
申请人 MATSUSHITA ELECTRONICS INDUSTRY CORP 发明人 HARADA YUJI
分类号 H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/824 主分类号 H01L21/8247
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