发明名称 MANUFACTURE OF ELECTRODE OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To form variation-less electrodes with high accuracy without using a vapor deposition method, etc., by performing electroless plating in a state where the photovoltaic power generated on silicon wafers is removed. SOLUTION: Silicon wafers W are housed in a rack 31 and the photovoltaic power generated on the wafers W is removed by throwing the rack 31 in a light shielding enclosure through a throwing-in port 10a and interrupting light or reducing the quantity of received light. Then, after the wafers W are washed with water by dipping the wafers W in a water bath 21 together with the rack 31, the natural oxide films formed on the surfaces of the wafers W are removed through acid treatment by appropriately repeatedly dipping the wafers W in a dilute nitric acid bath 22 and a sodium hydroxide bath 21 and again washing the wafers W with water by dipping the wafers W in the water bath 21. Thereafter, the wafers W are subjected to zincate treatment in a zincate bath 24 together with the rack 31 and, continuously, to electroless plating in an Ni bath 25 and an Au bath 26.
申请公布号 JP2000150422(A) 申请公布日期 2000.05.30
申请号 JP19980318965 申请日期 1998.11.10
申请人 SONY CORP 发明人 ISHIKAWA NATSUYA
分类号 C23C18/16;H01L21/288;(IPC1-7):H01L21/288 主分类号 C23C18/16
代理机构 代理人
主权项
地址