发明名称 |
Compliant interconnect for testing a semiconductor die |
摘要 |
A compliant interconnect for making a temporary (or permanent) electrical connection with a semiconductor die. The compliant interconnect includes raised contacts having penetrating projections for penetrating contact locations on the die (e.g., bond pads) to a limited penetration depth. In an illustrative embodiment the raised contacts are formed on a silicon substrate as raised pillars with a hollow etched interior portion. A tip of the raised contacts is formed as a thin flexible membrane to permit a desired amount of flexure or compliancy under loading from the die held in a test fixture. In an alternate embodiment the raised contacts are formed on a hollow flexible base portion. In another alternate embodiment the raised contacts are formed on a flexible membrane mounted to a support substrate having etched pockets filled with an elastomeric material.
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申请公布号 |
US6068669(A) |
申请公布日期 |
2000.05.30 |
申请号 |
US19970980466 |
申请日期 |
1997.11.28 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
FARNWORTH, WARREN M.;AKRAM, SALMAN;WOOD, ALAN G. |
分类号 |
G01R1/04;G01R1/067;G01R1/073;G01R3/00;G01R31/28;H01L21/60;H01L21/66;H01L21/68;H01L23/13;H01L23/498;H05K3/00;H05K3/40;H05K3/42;(IPC1-7):H01L21/00;H01L21/64 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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