CHIP COIL AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a chip coil which has high conductor filling property, regarding penetrating holes for electric bonding between conductor patterns constituting a coil conductor and can cope with miniaturization and high density wiring. SOLUTION: This chip coil is constituted by laminating insulating material layers 22 on which conductor patterns 23a, 23b, 23c are formed. The conductor patterns 23a, 23b, 23c form a coil inductor 23 by electrically connecting the terminal ends and starting ends of the conductor patterns 23a, 23b, 23c which are adjacent via insulating layer 22, interposing connecting conductors with which penetrating holes of the insulating material layers are filled. In a through- hole 24, an aperture area is reduced from the upper side of the thickness direction of the insulating material layer 22 toward the lower side, and the shape of the upper side aperture part and that of the lower side aperture part are not similar to each other.