| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed board, which can prevent voids in a laminate and delamination. SOLUTION: An inner layer pattern 11 is formed on an inner layer core 12. A prepreg and an outer layer copper foil 14 are overlaid on the inner layer pattern 11. These are pressed and heated by using a hot press machine to manufacture a multilayer printed board. In this lamination process for manufacturing a multilayer printed board, lamination is performed after a hole 13 is formed for a bonding resin to flow in the inner core 12. Consequently, voids in the laminate is prevented during the process of manufacturing a multilayer printed board. Thus, a manufacturing method of a multilayer printed board can be obtained that can prevent delamination. |
