| 摘要 |
PROBLEM TO BE SOLVED: To reduce the conductor land width and to improve workability for making the density high, by roughening the surface of an epoxy resin insulation layer with a plating catalyst which does not contain a glass cloth, applying adhesive, laminating a photosensitive dry film and making a hole and exposure- developing negative pattern where a plating resist layer is formed. SOLUTION: A glass epoxy copper-clad stack board with a plating catalyst is used for the inner layer base material of a multilayer wiring board. An inner layer circuit conductor 2 is etched and formed, is black-processed and a primer layer is formed on the inner layer circuit conductor 2. The insulation resin layer 3 of epoxy resin with plating catalyst, which do not contain a glass cloth, are formed on both faces. The whole area of the surface of the insulation resin layer 3 is roughened with potassium permanganate, adhesive with plating catalyst which improves the adhesion of plating copper is applied, and the adhesive layer 4 is formed. The photosensitive dry film 5 is laminated on the layer, non-through holes 7 are made and the film is exposed/developed and a resist layer 8 is formed. |
