| 摘要 |
PROBLEM TO BE SOLVED: To realize a resin-sealed semiconductor device which is of electrode base-exposed type and small in size by a method wherein a means which arranges lands as signal connection leads and a fixing means of a die pad are provided. SOLUTION: A terminal land frame is composed of a thin-walled fixing part which forms a base, an element mounting die pad 21, and lands 25 which serve as outer terminals when a semiconductor device is constituted, and a resin-sealed semiconductor device is formed by the use of the above terminal land frame. At this point, the resin-sealed semiconductor device is composed of the die pad 21, a semiconductor element 23 joined to the top surface of the die pad 21, and the lands 25 connected to the semiconductor element 23 with metal thin wires 24, where the lands 25 are arranged with their bases protruded from the base of the sealing resin 26 by a distance equal to the thickness of the fixed part of the terminal land frame. By this constitution, outer terminals can be efficiently disposed from the base in a standoff arrangement.
|
