| 摘要 |
PROBLEM TO BE SOLVED: To obtain a jet soldering apparatus which is capable of avoiding solder covering the substrates of different sizes and is capable of allowing a substrate to contact the solder jet in many directions of the substrate. SOLUTION: A chucking mechanism 3 moves a first nail and a second nail in the directions of mutually approaching or separating to nip or release a substrate by approaching the nails or separating the nails, respectively. The substrate is subjected to contact the solder jet in a jet soldering vessel 5 when the substrate is nipped wherein the first nail or the second nail is positioned in the front side of the transfer direction, and after being withdrawn from the solder jet, the substrate is released from the first nail and the second nail which are driven by the chucking mechanism. The substrate is then chucked by the first nail and the second nail on different sides other than the sides having been chucked so far to be adaptable to contact the solder jet in many directions of the substrate.
|
