ANISOTROPIC CONDUCTIVE ADHESIVE FILM

摘要

PROBLEM TO BE SOLVED: To suppress flow of conductive particles at the time of connection and to correspond to a fine pitch by uniformly arranging the conductive particles on the surface layer of insulating adhesive formed on a releasable film base material. SOLUTION: Conductive particles 1 are charged to the same level and are spread and they are uniformly arranged on the surface layer of an insulating adhesive layer 2 formed on a releasable film base material (separator) 3. A plastic film having a surface which is not made to adhere to insulating adhesive is overlapped on the surface of insulating adhesive 2, where the conductive particles 1 are arranged. It is pressed by pressing and lamination and it is buried into the surface layer of insulating adhesive by heating it. The separator 3 is released in a state where an adhesive film is temporarily stuck to a circuit. The other circuits to be connected are stuck to the face by heat pressing and heating rolling. Adhesive 2 is softened and it flows with heat and pressure and the conductive particles 1 with metal-coat the surface of a polymer nuclear body are also softened and deformed. Since they are brought into contact with each ether, the circuits can be made conductive.