发明名称 ELECTRONIC CIRCUIT, BOARD THEREFOR AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To obtain a board for electronic circuits, an electronic circuit and a manufacturing method thereof wherein the for thin and smooth electronic circuits, can absorb steps resulting from mounting of electronic components, though the components tend to be thin, has a high productivity and is precise, thin and smooth. SOLUTION: The board 1 for electronic circuits has an electric circuit having contact terminals of a metal foil formed on the surface of a base sheet 2 and has holes 3 for electronic components. Protrusions of the current terminals protrude on the electronic component holes 3, the metal foil is provided on the base sheet 2 through adhesives, and electronic components are mounted on the electronic circuit board 1, thus forming an electronic circuit according to the manufacturing method thereof.
申请公布号 JP2000151061(A) 申请公布日期 2000.05.30
申请号 JP19980315194 申请日期 1998.11.05
申请人 LINTEC CORP 发明人 ICHIKAWA AKIRA;AIZAWA KEIJI
分类号 H05K1/18;H05K1/02;H05K3/06;(IPC1-7):H05K1/18 主分类号 H05K1/18
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