发明名称 CONTACT FOR IC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide stable electrical connection to a contact part of a number of terminals by using a contact which is formed to a coil of one spring line material with conductivity and elasticity for a contact part of a number of terminals of a leadless type IC device. SOLUTION: A contact for an IC device used for a connector of a leadless type IC device is a contact for providing electrical connection to a contact part of a number of terminals of a leadless type LC device and a contact central winding part 1 is formed by coiling a spring line material with conductivity and elasticity formed of a copper or copper alloy fine line. That is, a diametrically reduced contact both sided winding part 2 is extended to both sides of the contact central winding part 1, and in the contact both sided winding part 2 at both sides, an inner side adherent winding part 2a, a clearance winding part 2b, an outside adherent winding part 2c and a contact part 2d are formed from an inside to an outside out by one.
申请公布号 JP2000150733(A) 申请公布日期 2000.05.30
申请号 JP19980330253 申请日期 1998.11.06
申请人 ITABASHI GIKEN KK;SAKAMOTO SUMIKO 发明人 ITABASHI KATSUMASA
分类号 H01L23/32;(IPC1-7):H01L23/32 主分类号 H01L23/32
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