| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor manufacturing apparatus capable of greatly reducing the downtime and hence improving the production efficiency over a long-term period. SOLUTION: Stepped portions (4a, 5a) are provided on an upper heater 1A and a lower heater 2A. The portions (4a, 5a) are overlapping portions constituting double walls with respect to a reaction tube 3, and move in directions opposite to each other while overlapping along a segment of a predetermined length when the heaters 1A and 2A move vertically. Further, holes 4b, 5b are formed in these overlapping portions, respectively. The holes 4b, 5b are through holes passing through the portions (4a, 5a) for discharging heat around the tube 3 to the outside when the portions (4a, 5a) move a distance which is shorter than the segment of the predetermined length from a state where the portions (4a, 5a) close the tube 3 to a state where they open the tube 3.
|
