SEMICONDUCTOR COOLING DEVICE

摘要

PROBLEM TO BE SOLVED: To improve cooling performance and make the device smaller and lighter. SOLUTION: An upper chamber 1 provided in the open part and a lower chamber 2 provided in the sealed part are air-tightly bonded with each other. Below the lower chamber 2, a plurality of flat semiconductor elements having cooling surfaces on both sides and cooling fins superimposed on the cooling surfaces of the both sides of the semiconductor elements are laminated alternately. The cooling fins 4 are air-tightly bonded with the lower chamber 2 via a cylindrical pipe 5 air-tightly connected with each fin. A refrigerant is sealed in the inner space of the sealed chamber consisting of the upper chamber 1, the lower chamber 2 and the cooling fin 4. The inner space of the sealed chamber is air-tightly divided into a first space of the upper chamber 1 and a second space shared by the lower chamber 2 and the cooling fin 4 by the part where the upper chamber 1 and the lower chamber 2 are air-tightly bonded. A first refrigerant 6 is sealed in the first space and a second refrigerant 6a, which is different from the first refrigerant 6, is sealed in the second space.