| 摘要 |
PROBLEM TO BE SOLVED: To realize high density mounting property, fast operation property and high reliability when a semiconductor element is subjected to flip chip mounting, by correcting deformation of a substrate caused by mounting of a surface mounting part in a mounting method of a semiconductor element for performing flip-chip mounting for a semiconductor element on a substrate after a surface mounting part is mounted on the substrate. SOLUTION: A groove processing part 2 formed in a position opposite to the shape of a surface mounting part mounted on both sides of a substrate, a plate 4 provided with an opening part 3 in a periphery of a semiconductor element and a plate 6 are constituted. The plates 4, 6 are mounted on a front side and a rear side of a substrate, a plurality of holes provided to the plates 4, 6 are fit to a hole provided to a substrate by using a regulation pin 10 and they are fastened and fixed by a fixing vis 7. As a result, a substrate is held and warp thereof is corrected. |
