| 摘要 |
PROBLEM TO BE SOLVED: To prevent an entire part from being disposed after assembly as a composite semiconductor device by mounting a plurality of conforming unit assembly bodies on a heat sink, then electrically connecting the unit assembly bodies to an external leading terminal for composing a specific circuit. SOLUTION: Electrical characteristics are inspected among conductor patterns 12a, 12b, and 12c in the state of a unit assembly body 8 with a unit insulation substrate 9. In this case, the unit assembly body 8 is placed on a heat sink 13, and an electrode for inspection is pressed onto the conductor patterns 12a, 12b, and 12c for inspection, thus screening conforming and nonconforming articles under a current condition of 100% of the rating. Then, after only the unit assembly body 8 that is found to be conforming is soldered and sealed on the heat sink 13, and then the unit assembly body 8 is electrically connected to an external leading terminal 14, thus composing a specific circuit and hence eliminating the abolition of an entire part after assembly as a composite semiconductor device and reducing assembly man-hours. |
