| 摘要 |
PROBLEM TO BE SOLVED: To prevent warpage of a semiconductor chip when a semiconductor chip with a plated heat sink(PHS) structure is mounted on a mount board. SOLUTION: In this semiconductor device, where a semiconductor chip 1 with a PHS structure constituted by forming an Au layer 12 on the rear side of a GaAs substrate 11 is mounted on a mount board 2; part of a Cu layer 21 constituting the mount board 2 is constituted by an Al layer 22 having a different heat expansion rate to form a multi-layered structure, and the warpage of the heated mount board 2 is made to match the warpage of the heated semiconductor chip 1. When the semiconductor chip 1 is mounted and cooled to room temperature, solder is solidified and the warpage of the semiconductor chip 1 and the mount substrate 2 is eliminated at the same time. Therefore, decrease in the mark detection rate caused by the tilted surface of the semiconductor chip 1 and the defective adhesion of bonding wires 6 caused by the tilted electrode pad 13 are prevented. |
