发明名称 HOLDING METHOD FOR PLASMA-PROCESSED SAMPLE
摘要 PROBLEM TO BE SOLVED: To simplify the setting operation of high-frequency power supply time by stopping supply of DC voltage, high-frequency power, and heat-transfer gas at the same time, then re-supplying DC voltage and high-frequency power in a specified time, and after that, sequentially stopping supply of DC voltage and high-frequency power. SOLUTION: At releasing a plasma-processed sample, firstly the supply of DC voltage, high-frequency power, and heat-transfer gas is simultaneously stopped. Then the DC voltage and high-frequency power are re-supplied in a specified period at the same time, before the supply of DC voltage and high-frequency power is sequentially stopped. At release of a semiconductor substrate A, the electric charge unevenly remaining at the semiconductor substrate A and a sample stage 5 is removed. So, inclination of the semiconductor substrate A when it is held is prevented. Thus, the supply period setting operation for high-frequency power after plasma process is simplified. A sample is held well at delivery.
申请公布号 JP2000150480(A) 申请公布日期 2000.05.30
申请号 JP19980322229 申请日期 1998.11.12
申请人 NEC KYUSHU LTD 发明人 TAKAHASHI MASAOMI
分类号 H01L21/302;C23F4/00;H01L21/3065;(IPC1-7):H01L21/306 主分类号 H01L21/302
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