| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of the connection point between a pin and a substrate in a process for minimizing a package element by recessing the region of each outer lead from a lead frame surface at depth for deforming toward the inside of a lead frame in the outer lead that is connected to a plurality of support bars. SOLUTION: One end of a plurality of inner leads 210 is connected to that of each outer lead 208, and the other end of each outer lead 208 is connected to each support bar 204. Then, in each outer lead 208, a cutting part 214 in a V shape is formed as a first separation part for separating a lead frame 202 from a side rail 200 in a first separation process. Similarly, in each outer lead 208, a cutting part 216 being recessed in a V shape is formed as a second separation part for separating the inner lead 210 from the outer lead 208, and each outer lead 28 is set to a depth where it is deformed to the inside of the lead frame 202.
|
