发明名称 Verknopingsmiddel voor fotolaklaag en fotolaklaagsamenstelling welke deze omvat.
摘要 The present invention relates to a cross-linker for photoresist compositions which is suitable for a photolithography process using KrF (248 mn), ArF (193 mn), E-beam, ion beam or EUV light sources. Preferred cross-linkers, according to the present invention, comprise a copolymer of (i) a compound represented by following Chemical Formula 1 and/or (ii) one or more compound(s) selected from the group consisting of acrylic acid, methacrylic acid and maleic anhydride.wherein, R1 and R2 individually represent straight or branched C1-10 alkyl, straight or branched C1-10 ester, straight or branched C1-10 ketone, straight or branched C1-10 carboxylic acid, straight or branched C1-10 acetal, straight or branched C1-10 alkyl including at least one hydroxyl group, straight or branched C1-10 ester including at least one hydroxyl group, straight or branched C1-10 ketone including at least one hydroxyl group, straight or branched C1-10 carboxylic acid including at least one hydroxyl group, and straight or branched C1-10 acetal including at least one hydroxyl group; and R3 represents hydrogen or methyl.
申请公布号 NL1013685(A1) 申请公布日期 2000.05.30
申请号 NL19991013685 申请日期 1999.11.26
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 JAE CHANG JUNG;KEUN KYU KONG;MYOUNG SOO KIM;HYOUNG GI KIM;HYEONG SOO KIM;KI HO BAIK;JIN SOO KIM
分类号 H01L21/027;C07C43/303;C07C47/277;C08F16/20;C08F16/38;C08F22/06;C08F32/00;C08F116/38;C08F216/38;C08F220/26;C08K5/00;C08L;G03F7/00;G03F7/004;G03F7/027;G03F7/033;G03F7/038;G03F7/039;H01L 主分类号 H01L21/027
代理机构 代理人
主权项
地址