发明名称 |
Polishing device and polishing cloth for semiconductor substrates |
摘要 |
The polishing device grinds or polishes semiconductor substrates. The device includes a polishing table, into which a measuring device is integrated and a through opening. A polishing cloth covers the polishing table. The polishing cloth has at least one opening formed therein which corresponds to the through opening in the polishing table. The invention also relates to a polishing cloth for use in the polishing device.
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申请公布号 |
US6068540(A) |
申请公布日期 |
2000.05.30 |
申请号 |
US19980080912 |
申请日期 |
1998.05.18 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
DICKENSCHEID, WOLFGANG;SPRINGER, GOETZ |
分类号 |
B24B49/00;B24D7/12;B24D13/14;(IPC1-7):B24D7/22 |
主分类号 |
B24B49/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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