| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive film for dicing, which can prevent the occurrence of chip flying and chipping when a thin wafer is diced. SOLUTION: An adhesive film for dicing is constituted by sticking a soft resin layer B carrying an adhesive layer A on one surface and having a thickness of 10-100μm and an elastic modulus in tension of 0.5-20 kgf/mm2 to another resin layer D carrying an adhesive layer C on one surface and having a thickness of 10-250μm and an elastic modulus in tension of 30-400 kgf/mm2 in such a way that the layers A, B, C, and D are piled up in this order.</p> |
