| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor element manufacturing device which can improve the spreading degree of an adhesive sheet without increasing the size of the device, and a method for using the device. SOLUTION: In the step after a semiconductor wafer 10 is divided into semiconductor elements 10, an adhesive sheet 12 is spread by pulling the central part of the sheet 12 in the radial direction, so that the annular section of the sheet 12 between the wafer 10 and ring 14 may be deformed in such a way that the cross section of the annular section is bent upward and downward along the recessed and projecting sections formed on the annular supporting surface 40a of a supporting member 40, and the recessed and projecting sections formed on the annular facing surface 38b of a sheet spreading member 38 by pinching the annular section of the sheet 12 between the recessed and projecting sections, when the sheet spreading member 38 presses down the wafer ring 14.</p> |
