| 摘要 |
PROBLEM TO BE SOLVED: To simplify the configuration without requiring a heat dissipation plate. SOLUTION: The package 6 of the device main body has fixing body 1 for adhesion for directly adhering the rear surface of a bare chip 4 onto the package 6 of the device main body by pressurizing a flexible substrate 2. A fixing hook 7 is inserted into a fixing hole 18 for the fixing hook 7 and the rear surface of the bare chip 4 is directly adhered and fixed to the package 6 by using elasticity of an elastic adjusting unit 19 for adhesion so that heat generated in the bare chip 4 is directly transferred to the package 6 of the device main body and dissipated. Occurrence of chip crack caused by heat expansion difference can be prevented by interposing a heat dissipating sheet between the bare chip 4 and the package 6. |
